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A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.

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Bibliographic Details
Title: A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics.
Authors: Liu, Hao1 (AUTHOR), Takakuwa, Masahito2,3 (AUTHOR), Yamamoto, Michitaka1 (AUTHOR), Wang, Yiwen1 (AUTHOR), Yokota, Tomoyuki2,3 (AUTHOR), Someya, Takao4 (AUTHOR), Itoh, Toshihiro1 (AUTHOR), Takamatsu, Seiichi4 (AUTHOR) stakamatsu@binghamton.edu
Source: Advanced Science. 4/17/2026, Vol. 13 Issue 22, p1-12. 12p.
Database: Academic Search Ultimate
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Description
ISSN:21983844
DOI:10.1002/advs.202518733