Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.
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| Title: | Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology. |
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| Authors: | Zhang, Shiqi1 (AUTHOR), Chen, Lizhen1,2 (AUTHOR) youzen@263.net, Fu, Jiangcheng1,2 (AUTHOR), Yang, Chenghu1,2 (AUTHOR), Chen, Guangli1 (AUTHOR) |
| Source: | Sensors (14248220). Apr2026, Vol. 26 Issue 8, p2292. 33p. |
| Database: | Academic Search Ultimate |
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| ISSN: | 14248220 |
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| DOI: | 10.3390/s26082292 |
