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Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.

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Title: Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.
Authors: Zhang, Shiqi1 (AUTHOR), Chen, Lizhen1,2 (AUTHOR) youzen@263.net, Fu, Jiangcheng1,2 (AUTHOR), Yang, Chenghu1,2 (AUTHOR), Chen, Guangli1 (AUTHOR)
Source: Sensors (14248220). Apr2026, Vol. 26 Issue 8, p2292. 33p.
Database: Academic Search Ultimate
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  Data: <searchLink fieldCode="JN" term="%22Sensors+%2814248220%29%22">Sensors (14248220)</searchLink>. Apr2026, Vol. 26 Issue 8, p2292. 33p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=193416056
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