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Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging.

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Bibliographic Details
Title: Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging.
Authors: Gao, Mingqi1,2 (AUTHOR), Lei, Dongyang2 (AUTHOR), Zhang, Yagang1,3 (AUTHOR) ygzhang@uestc.edu.cn, Ye, Huijie1,2 (AUTHOR), Zhang, Yanming2 (AUTHOR), Zeng, Ce2,3 (AUTHOR), Hu, Tong1 (AUTHOR), Jiang, Hai2 (AUTHOR), Lu, Qian2 (AUTHOR), Yang, Yueyou2 (AUTHOR), Zhang, An2 (AUTHOR)
Source: Solids (2673-6497). Apr2026, Vol. 7 Issue 2, p18. 19p.
Database: Academic Search Ultimate
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ISSN:26736497
DOI:10.3390/solids7020018