APA (7th ed.) Citation

Gao, M., Lei, D., Zhang, Y., Ye, H., Zhang, Y., Zeng, C., . . . Zhang, A. (2026). Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging. Solids (2673-6497), 7(2), 18. https://doi.org/10.3390/solids7020018

Chicago Style (17th ed.) Citation

Gao, Mingqi, et al. "Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging." Solids (2673-6497) 7, no. 2 (2026): 18. https://doi.org/10.3390/solids7020018.

MLA (9th ed.) Citation

Gao, Mingqi, et al. "Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging." Solids (2673-6497), vol. 7, no. 2, 2026, p. 18, https://doi.org/10.3390/solids7020018.