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Thermal Buckling Analysis of Bimodular Functionally Graded Rectangular Thin Plates.

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Bibliographic Details
Title: Thermal Buckling Analysis of Bimodular Functionally Graded Rectangular Thin Plates.
Authors: He, Xiao-Ting1,2 (AUTHOR), Zhang, Xiao-Wei1,2 (AUTHOR), Sun, Jun-Yi1,2 (AUTHOR), Guo, Ying1,2 (AUTHOR) guoying@cqu.edu.cn
Source: Mathematics (2227-7390). Jun2026, Vol. 14 Issue 11, p1809. 38p.
Database: Academic Search Ultimate
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ISSN:22277390
DOI:10.3390/math14111809