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Thermal Buckling Analysis of Bimodular Functionally Graded Rectangular Thin Plates.

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Title: Thermal Buckling Analysis of Bimodular Functionally Graded Rectangular Thin Plates.
Authors: He, Xiao-Ting1,2 (AUTHOR), Zhang, Xiao-Wei1,2 (AUTHOR), Sun, Jun-Yi1,2 (AUTHOR), Guo, Ying1,2 (AUTHOR) guoying@cqu.edu.cn
Source: Mathematics (2227-7390). Jun2026, Vol. 14 Issue 11, p1809. 38p.
Database: Academic Search Ultimate
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  Data: Thermal Buckling Analysis of Bimodular Functionally Graded Rectangular Thin Plates.
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  Data: <searchLink fieldCode="JN" term="%22Mathematics+%282227-7390%29%22">Mathematics (2227-7390)</searchLink>. Jun2026, Vol. 14 Issue 11, p1809. 38p.
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.3390/math14111809
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      – Code: eng
        Text: English
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        PageCount: 38
        StartPage: 1809
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      – TitleFull: Thermal Buckling Analysis of Bimodular Functionally Graded Rectangular Thin Plates.
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            NameFull: He, Xiao-Ting
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            NameFull: Zhang, Xiao-Wei
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            NameFull: Sun, Jun-Yi
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              Text: Jun2026
              Type: published
              Y: 2026
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              Value: 14
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              Value: 11
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