Effects of die aspect ratio on mold flow and structural behaviour in wafer-level encapsulation process.
Saved in:
| Title: | Effects of die aspect ratio on mold flow and structural behaviour in wafer-level encapsulation process. |
|---|---|
| Authors: | Othman, Ainnur Hanim1 (AUTHOR) ainnurhanim.othman@gmail.com, Qing, Ooi Teng1 (AUTHOR) ooitengqing@gmail.com, Abdul Aziz, Mohd Sharizal2 (AUTHOR) msharizal@usm.my, Ishak, Mohammad Hafifi Hafiz1 (AUTHOR) mhafifihafiz@usm.my, Nashrudin, Muhammad Naqib3 (AUTHOR) muhammad.naqib.nashrudin@intel.com, Azman, Muhammad Aqil2,3 (AUTHOR) muhammad.aqil.azman@intel.com |
| Source: | International Journal of Advanced Manufacturing Technology. Jun2026, p1-18. 18p. |
| Database: | Academic Search Ultimate |
| ISSN: | 02683768 |
|---|---|
| DOI: | 10.1007/s00170-026-18520-9 |
