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Effects of die aspect ratio on mold flow and structural behaviour in wafer-level encapsulation process.

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Title: Effects of die aspect ratio on mold flow and structural behaviour in wafer-level encapsulation process.
Authors: Othman, Ainnur Hanim1 (AUTHOR) ainnurhanim.othman@gmail.com, Qing, Ooi Teng1 (AUTHOR) ooitengqing@gmail.com, Abdul Aziz, Mohd Sharizal2 (AUTHOR) msharizal@usm.my, Ishak, Mohammad Hafifi Hafiz1 (AUTHOR) mhafifihafiz@usm.my, Nashrudin, Muhammad Naqib3 (AUTHOR) muhammad.naqib.nashrudin@intel.com, Azman, Muhammad Aqil2,3 (AUTHOR) muhammad.aqil.azman@intel.com
Source: International Journal of Advanced Manufacturing Technology. Jun2026, p1-18. 18p.
Database: Academic Search Ultimate
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Header DbId: asn
DbLabel: Academic Search Ultimate
An: 194746966
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Effects of die aspect ratio on mold flow and structural behaviour in wafer-level encapsulation process.
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  Data: <searchLink fieldCode="AR" term="%22Othman%2C+Ainnur+Hanim%22">Othman, Ainnur Hanim</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> ainnurhanim.othman@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Qing%2C+Ooi+Teng%22">Qing, Ooi Teng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> ooitengqing@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Abdul+Aziz%2C+Mohd+Sharizal%22">Abdul Aziz, Mohd Sharizal</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> msharizal@usm.my</i><br /><searchLink fieldCode="AR" term="%22Ishak%2C+Mohammad+Hafifi+Hafiz%22">Ishak, Mohammad Hafifi Hafiz</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> mhafifihafiz@usm.my</i><br /><searchLink fieldCode="AR" term="%22Nashrudin%2C+Muhammad+Naqib%22">Nashrudin, Muhammad Naqib</searchLink><relatesTo>3</relatesTo> (AUTHOR)<i> muhammad.naqib.nashrudin@intel.com</i><br /><searchLink fieldCode="AR" term="%22Azman%2C+Muhammad+Aqil%22">Azman, Muhammad Aqil</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<i> muhammad.aqil.azman@intel.com</i>
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Jun2026, p1-18. 18p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=194746966
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      – Type: doi
        Value: 10.1007/s00170-026-18520-9
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      – Code: eng
        Text: English
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        PageCount: 18
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      – TitleFull: Effects of die aspect ratio on mold flow and structural behaviour in wafer-level encapsulation process.
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            NameFull: Othman, Ainnur Hanim
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            NameFull: Qing, Ooi Teng
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            NameFull: Abdul Aziz, Mohd Sharizal
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            NameFull: Ishak, Mohammad Hafifi Hafiz
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            NameFull: Nashrudin, Muhammad Naqib
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              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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