Interconnect Reliability Investigation for a High‐Integration Dual‐Channel Receiver Front End.
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| Title: | Interconnect Reliability Investigation for a High‐Integration Dual‐Channel Receiver Front End. |
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| Authors: | Lin, Qian1 (AUTHOR) abgott@126.com, Zhang, Bo‐Hao1 (AUTHOR), Zhao, Peng‐Fei2 (AUTHOR), Tong, Wei2 (AUTHOR), Wang, Ce‐Tian2 (AUTHOR), Wu, Hai‐Feng2 (AUTHOR) linqian@tju.edu.cn |
| Source: | International Journal of Circuit Theory & Applications. Jul2026, p1. 11p. 21 Illustrations. |
| Database: | Academic Search Ultimate |
| FullText | Text: Availability: 0 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 195175023 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Interconnect Reliability Investigation for a High‐Integration Dual‐Channel Receiver Front End. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Lin%2C+Qian%22">Lin, Qian</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> abgott@126.com</i><br /><searchLink fieldCode="AR" term="%22Zhang%2C+Bo‐Hao%22">Zhang, Bo‐Hao</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhao%2C+Peng‐Fei%22">Zhao, Peng‐Fei</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Tong%2C+Wei%22">Tong, Wei</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Ce‐Tian%22">Wang, Ce‐Tian</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wu%2C+Hai‐Feng%22">Wu, Hai‐Feng</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> linqian@tju.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Circuit+Theory+%26+Applications%22">International Journal of Circuit Theory & Applications</searchLink>. Jul2026, p1. 11p. 21 Illustrations. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=195175023 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1002/cta.70526 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 1 Titles: – TitleFull: Interconnect Reliability Investigation for a High‐Integration Dual‐Channel Receiver Front End. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Lin, Qian – PersonEntity: Name: NameFull: Zhang, Bo‐Hao – PersonEntity: Name: NameFull: Zhao, Peng‐Fei – PersonEntity: Name: NameFull: Tong, Wei – PersonEntity: Name: NameFull: Wang, Ce‐Tian – PersonEntity: Name: NameFull: Wu, Hai‐Feng IsPartOfRelationships: – BibEntity: Dates: – D: 09 M: 07 Text: Jul2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 00989886 Titles: – TitleFull: International Journal of Circuit Theory & Applications Type: main |
| ResultId | 1 |