Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation.
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| Title: | Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation. |
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| Authors: | Ran, Xu1 (AUTHOR), Wang, Yaru1 (AUTHOR), Wu, Sijia1 (AUTHOR), Wang, Hejun1 (AUTHOR), Shen, Junhao1 (AUTHOR), Sun, Litao2 (AUTHOR), Wu, Xing1 (AUTHOR) xwu@cee.ecnu.edu.cn, Bi, Hengchang1 (AUTHOR) hcbi@cee.ecnu.edu.cn |
| Source: | Advanced Science. 7/13/2026, Vol. 13 Issue 39, p1-10. 10p. |
| Database: | Academic Search Ultimate |
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| ISSN: | 21983844 |
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| DOI: | 10.1002/advs.75359 |
