APA (7th ed.) Citation

Ran, X., Wang, Y., Wu, S., Wang, H., Shen, J., Sun, L., . . . Bi, H. (2026). Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation. Advanced Science, 13(39), 1. https://doi.org/10.1002/advs.75359

Chicago Style (17th ed.) Citation

Ran, Xu, Yaru Wang, Sijia Wu, Hejun Wang, Junhao Shen, Litao Sun, Xing Wu, and Hengchang Bi. "Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation." Advanced Science 13, no. 39 (2026): 1. https://doi.org/10.1002/advs.75359.

MLA (9th ed.) Citation

Ran, Xu, et al. "Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation." Advanced Science, vol. 13, no. 39, 2026, p. 1, https://doi.org/10.1002/advs.75359.