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Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation.

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Title: Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation.
Authors: Ran, Xu1 (AUTHOR), Wang, Yaru1 (AUTHOR), Wu, Sijia1 (AUTHOR), Wang, Hejun1 (AUTHOR), Shen, Junhao1 (AUTHOR), Sun, Litao2 (AUTHOR), Wu, Xing1 (AUTHOR) xwu@cee.ecnu.edu.cn, Bi, Hengchang1 (AUTHOR) hcbi@cee.ecnu.edu.cn
Source: Advanced Science. 7/13/2026, Vol. 13 Issue 39, p1-10. 10p.
Database: Academic Search Ultimate
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Header DbId: asn
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An: 195314267
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation.
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  Data: <searchLink fieldCode="JN" term="%22Advanced+Science%22">Advanced Science</searchLink>. 7/13/2026, Vol. 13 Issue 39, p1-10. 10p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=195314267
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        Value: 10.1002/advs.75359
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      – Code: eng
        Text: English
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        PageCount: 10
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      – TitleFull: Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation.
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            NameFull: Ran, Xu
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            NameFull: Wang, Hejun
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            NameFull: Shen, Junhao
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            – D: 13
              M: 07
              Text: 7/13/2026
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              Y: 2026
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            – TitleFull: Advanced Science
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