Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions.
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| Title: | Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions. |
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| Authors: | SUBRAMANIAN, K. N.1 subraman@egr.msu.edu |
| Source: | Fatigue & Fracture of Engineering Materials & Structures. May2007, Vol. 30 Issue 5, p420-431. 12p. 14 Diagrams, 2 Charts, 5 Graphs. |
| Database: | Academic Search Ultimate |
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