Mechanical strength of chip scale package with various underfills under accelerated thermal condition.
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| Title: | Mechanical strength of chip scale package with various underfills under accelerated thermal condition. |
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| Authors: | Noh, B. -I.1, Lee, B. -Y.2, Jung, S. -B.1 sbjung@skku.ac.kr |
| Source: | Materials Science & Technology. Jul2007, Vol. 23 Issue 7, p828-832. 5p. 4 Diagrams, 2 Charts, 2 Graphs. |
| Database: | Academic Search Ultimate |
| ISSN: | 02670836 |
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| DOI: | 10.1179/174328407X192750 |
