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Mechanical strength of chip scale package with various underfills under accelerated thermal condition.

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Title: Mechanical strength of chip scale package with various underfills under accelerated thermal condition.
Authors: Noh, B. -I.1, Lee, B. -Y.2, Jung, S. -B.1 sbjung@skku.ac.kr
Source: Materials Science & Technology. Jul2007, Vol. 23 Issue 7, p828-832. 5p. 4 Diagrams, 2 Charts, 2 Graphs.
Database: Academic Search Ultimate
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An: 25998437
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PubType: Academic Journal
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  Data: Mechanical strength of chip scale package with various underfills under accelerated thermal condition.
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  Data: <searchLink fieldCode="AR" term="%22Noh%2C+B%2E+-I%2E%22">Noh, B. -I.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Lee%2C+B%2E+-Y%2E%22">Lee, B. -Y.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Jung%2C+S%2E+-B%2E%22">Jung, S. -B.</searchLink><relatesTo>1</relatesTo><i> sbjung@skku.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Materials+Science+%26+Technology%22">Materials Science & Technology</searchLink>. Jul2007, Vol. 23 Issue 7, p828-832. 5p. 4 Diagrams, 2 Charts, 2 Graphs.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=25998437
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        Value: 10.1179/174328407X192750
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      – Code: eng
        Text: English
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      – TitleFull: Mechanical strength of chip scale package with various underfills under accelerated thermal condition.
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