Modeling adhesive wear resistance of Al-Si-Mg-/SiCp PM compacts fabricated by hot pressing process, by means of ANN.

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Bibliographic Details
Title: Modeling adhesive wear resistance of Al-Si-Mg-/SiCp PM compacts fabricated by hot pressing process, by means of ANN.
Authors: Taskin, Mustafa1 mtaskin@firat.edu.tr, Caligulu, Ugur1 ucaligulu@firat.edu.tr, Gur, Ali Kaya1 akgur@firat.edu.tr
Source: International Journal of Advanced Manufacturing Technology. Jun2008, Vol. 37 Issue 7/8, p715-721. 7p. 5 Diagrams, 4 Charts, 4 Graphs.
Database: Academic Search Ultimate
Description
ISSN:02683768
DOI:10.1007/s00170-007-1000-5