A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging.
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| Title: | A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging. |
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| Authors: | Lin, D. C.1, Kovacevic, R.1, Srivatsan, T. S.2 tsrivatsan@uakron.edu, Wang, G. X.2 |
| Source: | Sādhanā: Academy Proceedings in Engineering Sciences. Jun2008, Vol. 33 Issue 3, p251-259. 9p. 4 Black and White Photographs, 3 Charts, 3 Graphs. |
| Database: | Academic Search Ultimate |
| ISSN: | 02562499 |
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| DOI: | 10.1007/s12046-008-0018-1 |
