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A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging.

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Title: A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging.
Authors: Lin, D. C.1, Kovacevic, R.1, Srivatsan, T. S.2 tsrivatsan@uakron.edu, Wang, G. X.2
Source: Sādhanā: Academy Proceedings in Engineering Sciences. Jun2008, Vol. 33 Issue 3, p251-259. 9p. 4 Black and White Photographs, 3 Charts, 3 Graphs.
Database: Academic Search Ultimate
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  Data: A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging.
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  Data: <searchLink fieldCode="AR" term="%22Lin%2C+D%2E+C%2E%22">Lin, D. C.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kovacevic%2C+R%2E%22">Kovacevic, R.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Srivatsan%2C+T%2E+S%2E%22">Srivatsan, T. S.</searchLink><relatesTo>2</relatesTo><i> tsrivatsan@uakron.edu</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+G%2E+X%2E%22">Wang, G. X.</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Sādhanā%3A+Academy+Proceedings+in+Engineering+Sciences%22">Sādhanā: Academy Proceedings in Engineering Sciences</searchLink>. Jun2008, Vol. 33 Issue 3, p251-259. 9p. 4 Black and White Photographs, 3 Charts, 3 Graphs.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=33018648
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        Value: 10.1007/s12046-008-0018-1
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      – Code: eng
        Text: English
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      – TitleFull: A study aimed at characterizing the interfacial structure in a tin-silver solder on nickel-coated copper plate during aging.
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              Text: Jun2008
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              Y: 2008
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              Value: 33
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