Solder joint inspection with multi-angle imaging and an artificial neural network.
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| Title: | Solder joint inspection with multi-angle imaging and an artificial neural network. |
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| Authors: | Ong, T. Y.1 TengYeowOng@gmail.com, Samad, Z.1, Ratnam, M. M.1 |
| Source: | International Journal of Advanced Manufacturing Technology. Sep2008, Vol. 38 Issue 5/6, p455-462. 8p. 1 Color Photograph, 5 Diagrams, 2 Charts, 3 Graphs. |
| Database: | Academic Search Ultimate |
| ISSN: | 02683768 |
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| DOI: | 10.1007/s00170-007-1117-6 |
