Bumping of QFNs/LGAs and Other Leadless Devices for More Consistent Rework.

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Bibliographic Details
Title:	Bumping of QFNs/LGAs and Other Leadless Devices for More Consistent Rework.
Authors:	Wettermann, Bob¹
Source:	SMT: Surface Mount Technology. Aug2016, Vol. 31 Issue 8, p72-75. 3p.
Database:	Business Source Ultimate

Description
ISSN:	15298930