Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system.
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| Title: | Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system. |
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| Authors: | Friedrich, Michael1 (AUTHOR) michael.friedrich@cs.tu-chemnitz.de, Schlosser, Tobias1 (AUTHOR) tobias.schlosser@cs.tu-chemnitz.de, Kowerko, Danny1 (AUTHOR) danny.kowerko@cs.tu-chemnitz.de |
| Source: | Journal of Intelligent Manufacturing. Feb2026, Vol. 37 Issue 2, p573-596. 24p. |
| Database: | Business Source Ultimate |
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| ISSN: | 09565515 |
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| DOI: | 10.1007/s10845-024-02559-0 |
