Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.

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Bibliographic Details
Title:	Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.
Authors:	Chhawcharia, Pradeep¹ hodece@gits.ac.in, Sabir, Mohammad¹ sabii.sankhla@gmail.com, Sharma, Ishita¹, Katariya, Himani¹, Soni, Sumedha¹, Mehta, Divyansh¹
Source:	Advances in Consumer Research. Dec2025, Vol. 2 Issue 6, p961-966. 6p.
Database:	Business Source Ultimate

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ISSN:	00989258