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Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.

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Title: Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.
Authors: Chhawcharia, Pradeep1 hodece@gits.ac.in, Sabir, Mohammad1 sabii.sankhla@gmail.com, Sharma, Ishita1, Katariya, Himani1, Soni, Sumedha1, Mehta, Divyansh1
Source: Advances in Consumer Research. Dec2025, Vol. 2 Issue 6, p961-966. 6p.
Database: Business Source Ultimate
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  Data: Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.
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  Data: <searchLink fieldCode="JN" term="%22Advances+in+Consumer+Research%22">Advances in Consumer Research</searchLink>. Dec2025, Vol. 2 Issue 6, p961-966. 6p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bsu&AN=191553108
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              Text: Dec2025
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              Y: 2025
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