Bibliographic Details
| Title: |
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging. |
| Authors: |
Muhamed Mukhtar, Muhamed Abdul Fatah1 (AUTHOR) fatahmukhtar@usm.my, Phang, Jia Xin1 (AUTHOR) jiaxinphang@gmail.com, Abd Khalid, Nor Rashikin1 (AUTHOR) norrashikinabdkhalid@gmail.com, Abdullah, Muhammad Khalil1 (AUTHOR) mkhalil@usm.my, Ramli, Mohamad Riduwan1 (AUTHOR) riduwan@usm.my |
| Source: |
Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 3, p205-215. 11p. |
| Database: |
Business Source Ultimate |
