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Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging.

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Title: Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging.
Authors: Muhamed Mukhtar, Muhamed Abdul Fatah1 (AUTHOR) fatahmukhtar@usm.my, Phang, Jia Xin1 (AUTHOR) jiaxinphang@gmail.com, Abd Khalid, Nor Rashikin1 (AUTHOR) norrashikinabdkhalid@gmail.com, Abdullah, Muhammad Khalil1 (AUTHOR) mkhalil@usm.my, Ramli, Mohamad Riduwan1 (AUTHOR) riduwan@usm.my
Source: Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 3, p205-215. 11p.
Database: Business Source Ultimate
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  Availability: 0
Header DbId: bsu
DbLabel: Business Source Ultimate
An: 193409911
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging.
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  Data: <searchLink fieldCode="JN" term="%22Soldering+%26+Surface+Mount+Technology%22">Soldering & Surface Mount Technology</searchLink>. 2026, Vol. 38 Issue 3, p205-215. 11p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bsu&AN=193409911
RecordInfo BibRecord:
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    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 11
        StartPage: 205
    Titles:
      – TitleFull: Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Muhamed Mukhtar, Muhamed Abdul Fatah
      – PersonEntity:
          Name:
            NameFull: Phang, Jia Xin
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            NameFull: Abd Khalid, Nor Rashikin
      – PersonEntity:
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            NameFull: Abdullah, Muhammad Khalil
      – PersonEntity:
          Name:
            NameFull: Ramli, Mohamad Riduwan
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          Dates:
            – D: 01
              M: 05
              Text: 2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 09540911
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              Value: 38
            – Type: issue
              Value: 3
          Titles:
            – TitleFull: Soldering & Surface Mount Technology
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