L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits.
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| Title: | L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits. |
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| Authors: | Xiang, Yuyan1 (AUTHOR) 1049840307@qq.com, Jingming, Fei1 (AUTHOR) fjmhit@163.com, Hongmei, Zhang1 (AUTHOR) 18333606193@163.com, Qi, An1 (AUTHOR) 805525071@qq.com |
| Source: | Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 4, p245-256. 12p. |
| Database: | Business Source Ultimate |
| ISSN: | 09540911 |
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