Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects.
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| Title: | Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects. |
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| Authors: | Ju, Fan1 (AUTHOR) 15191977700@163.com, Pu, Jie1 (AUTHOR) pujie15306271639@163.com, Wang, Yuebing1 (AUTHOR) yuebingwang99@163.com, Yang, Cheng1 (AUTHOR) yang_202510@126.com, Dai, Feihu1 (AUTHOR) 15189750872@163.com, Ji, Yong1 (AUTHOR) 15722996632@163.com, Wang, Chengqian1 (AUTHOR) chengqiankk@126.com |
| Source: | Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 4, p308-318. 11p. |
| Database: | Business Source Ultimate |
| ISSN: | 09540911 |
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