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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects.

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Title: Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects.
Authors: Ju, Fan1 (AUTHOR) 15191977700@163.com, Pu, Jie1 (AUTHOR) pujie15306271639@163.com, Wang, Yuebing1 (AUTHOR) yuebingwang99@163.com, Yang, Cheng1 (AUTHOR) yang_202510@126.com, Dai, Feihu1 (AUTHOR) 15189750872@163.com, Ji, Yong1 (AUTHOR) 15722996632@163.com, Wang, Chengqian1 (AUTHOR) chengqiankk@126.com
Source: Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 4, p308-318. 11p.
Database: Business Source Ultimate
FullText Text:
  Availability: 0
Header DbId: bsu
DbLabel: Business Source Ultimate
An: 194604085
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Ju%2C+Fan%22">Ju, Fan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 15191977700@163.com</i><br /><searchLink fieldCode="AR" term="%22Pu%2C+Jie%22">Pu, Jie</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> pujie15306271639@163.com</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Yuebing%22">Wang, Yuebing</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yuebingwang99@163.com</i><br /><searchLink fieldCode="AR" term="%22Yang%2C+Cheng%22">Yang, Cheng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yang_202510@126.com</i><br /><searchLink fieldCode="AR" term="%22Dai%2C+Feihu%22">Dai, Feihu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 15189750872@163.com</i><br /><searchLink fieldCode="AR" term="%22Ji%2C+Yong%22">Ji, Yong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 15722996632@163.com</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Chengqian%22">Wang, Chengqian</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> chengqiankk@126.com</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Soldering+%26+Surface+Mount+Technology%22">Soldering & Surface Mount Technology</searchLink>. 2026, Vol. 38 Issue 4, p308-318. 11p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bsu&AN=194604085
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 11
        StartPage: 308
    Titles:
      – TitleFull: Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Ju, Fan
      – PersonEntity:
          Name:
            NameFull: Pu, Jie
      – PersonEntity:
          Name:
            NameFull: Wang, Yuebing
      – PersonEntity:
          Name:
            NameFull: Yang, Cheng
      – PersonEntity:
          Name:
            NameFull: Dai, Feihu
      – PersonEntity:
          Name:
            NameFull: Ji, Yong
      – PersonEntity:
          Name:
            NameFull: Wang, Chengqian
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 07
              Text: 2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 09540911
          Numbering:
            – Type: volume
              Value: 38
            – Type: issue
              Value: 4
          Titles:
            – TitleFull: Soldering & Surface Mount Technology
              Type: main
ResultId 1