ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System.
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| Title: | ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System. |
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| Source: | ThomasNet News. 3/25/2016, p1-1. 1p. |
| Subjects: | Electro Scientific Industries Inc., Georgia Institute of Technology, Business partnerships, Laser drilling, Microelectronics, Tummala, Rao |
| Abstract: | The article reports that technology company Electro Scientific Industries (ESI) has joined the Georgia Institute of Technology 3D Systems Packaging Research Center (PRC) as a full member. It mentions that as part of the partnership ESI has installed the CornerStone ICP Ultraviolet laser drilling system at the center for future redistribution layers used in microelectronics. It also offers the views of Rao Tummala, Center Director of PRC, on the performance of ESI's technology at the center. |
| Database: | Regional Business News |
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| Abstract: | The article reports that technology company Electro Scientific Industries (ESI) has joined the Georgia Institute of Technology 3D Systems Packaging Research Center (PRC) as a full member. It mentions that as part of the partnership ESI has installed the CornerStone ICP Ultraviolet laser drilling system at the center for future redistribution layers used in microelectronics. It also offers the views of Rao Tummala, Center Director of PRC, on the performance of ESI's technology at the center. |
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