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ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System.

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Bibliographic Details
Title: ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System.
Source: ThomasNet News. 3/25/2016, p1-1. 1p.
Subjects: Electro Scientific Industries Inc., Georgia Institute of Technology, Business partnerships, Laser drilling, Microelectronics, Tummala, Rao
Abstract: The article reports that technology company Electro Scientific Industries (ESI) has joined the Georgia Institute of Technology 3D Systems Packaging Research Center (PRC) as a full member. It mentions that as part of the partnership ESI has installed the CornerStone ICP Ultraviolet laser drilling system at the center for future redistribution layers used in microelectronics. It also offers the views of Rao Tummala, Center Director of PRC, on the performance of ESI's technology at the center.
Database: Regional Business News
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  Availability: 1
Header DbId: bwh
DbLabel: Regional Business News
An: 114042568
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System.
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  Group: Src
  Data: <searchLink fieldCode="JN" term="%22ThomasNet+News%22">ThomasNet News</searchLink>. 3/25/2016, p1-1. 1p.
– Name: Subject
  Label: Subjects
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  Data: <searchLink fieldCode="DE" term="%22Electro+Scientific+Industries+Inc%2E%22">Electro Scientific Industries Inc.</searchLink><br /><searchLink fieldCode="DE" term="%22Georgia+Institute+of+Technology%22">Georgia Institute of Technology</searchLink><br /><searchLink fieldCode="DE" term="%22Business+partnerships%22">Business partnerships</searchLink><br /><searchLink fieldCode="DE" term="%22Laser+drilling%22">Laser drilling</searchLink><br /><searchLink fieldCode="DE" term="%22Microelectronics%22">Microelectronics</searchLink><br /><searchLink fieldCode="DE" term="%22Tummala%2C+Rao%22">Tummala, Rao</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The article reports that technology company Electro Scientific Industries (ESI) has joined the Georgia Institute of Technology 3D Systems Packaging Research Center (PRC) as a full member. It mentions that as part of the partnership ESI has installed the CornerStone ICP Ultraviolet laser drilling system at the center for future redistribution layers used in microelectronics. It also offers the views of Rao Tummala, Center Director of PRC, on the performance of ESI's technology at the center.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bwh&AN=114042568
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 1
        StartPage: 1
    Subjects:
      – SubjectFull: Electro Scientific Industries Inc.
        Type: general
      – SubjectFull: Georgia Institute of Technology
        Type: general
      – SubjectFull: Business partnerships
        Type: general
      – SubjectFull: Laser drilling
        Type: general
      – SubjectFull: Microelectronics
        Type: general
      – SubjectFull: Tummala, Rao
        Type: general
    Titles:
      – TitleFull: ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System.
        Type: main
  BibRelationships:
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          Dates:
            – D: 25
              M: 03
              Text: 3/25/2016
              Type: published
              Y: 2016
          Titles:
            – TitleFull: ThomasNet News
              Type: main
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