APA (7th ed.) Citation

Chen, H., Liu, Z., Huang, S., Pan, H., & Qiu, M. (2015). Study of the mechanism of multi-channel discharge in semiconductor processing by WEDM. Materials Science in Semiconductor Processing, 32, 125. https://doi.org/10.1016/j.mssp.2014.12.061

Chicago Style (17th ed.) Citation

Chen, Hao-ran, Zhi-dong Liu, Sai-juan Huang, Hui-jun Pan, and Ming-bo Qiu. "Study of the Mechanism of Multi-channel Discharge in Semiconductor Processing by WEDM." Materials Science in Semiconductor Processing 32 (2015): 125. https://doi.org/10.1016/j.mssp.2014.12.061.

MLA (9th ed.) Citation

Chen, Hao-ran, et al. "Study of the Mechanism of Multi-channel Discharge in Semiconductor Processing by WEDM." Materials Science in Semiconductor Processing, vol. 32, 2015, p. 125, https://doi.org/10.1016/j.mssp.2014.12.061.