View in EDS PDF Full Text

Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass.

Saved in:
Bibliographic Details
Title: Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass.
Authors: Hsieh, J. H.1 mjhhsieh@ntu.edu.sg, Tzong-Ming Wu2, Tong, J. Z.2, Yang, S.3
Source: Journal of Adhesion Science & Technology. 12/25/2003, Vol. 17 Issue 15, p2085-2095. 11p.
Subjects: Adhesion, Metallizing, Metal coating, Wire bonding (Electronic packaging), Adsorption (Chemistry), Indium
Abstract: Metallization of indium-tin-oxide (ITO)-coated glass using an Al/Cr composite thin film is a common practice for chip-on-glass packaging. However, the reliability of the Cr/ITO interface is always a problem because of poor adhesion due to the chemical inertness of ITO. In this study, the adhesion strength between a Cr film and ITO coated glass was enhanced by forming an intermediate oxide layer at the interface. To find out the optimal interface condition, various amounts of oxygen were doped at the interface. The results show that the adhesion strength and thermal stability are both enhanced by the interfacial doping of oxygen. This enhancement is found to be related to the flow rate of oxygen and, therefore, to the oxide thickness. Maximum improvement occurs when the flow rate of oxygen is set at 6 sccm during doping, and at this rate the interface oxide thickness also reaches its maximum value. Under this condition, the Cr/ITO interface also shows the best thermal stability. Wire bond testing shows that the wire pull strength is affected by the thickness of Al film. The results of this study show that the Al film should not be thicker than 1 μm. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
Description
Abstract:Metallization of indium-tin-oxide (ITO)-coated glass using an Al/Cr composite thin film is a common practice for chip-on-glass packaging. However, the reliability of the Cr/ITO interface is always a problem because of poor adhesion due to the chemical inertness of ITO. In this study, the adhesion strength between a Cr film and ITO coated glass was enhanced by forming an intermediate oxide layer at the interface. To find out the optimal interface condition, various amounts of oxygen were doped at the interface. The results show that the adhesion strength and thermal stability are both enhanced by the interfacial doping of oxygen. This enhancement is found to be related to the flow rate of oxygen and, therefore, to the oxide thickness. Maximum improvement occurs when the flow rate of oxygen is set at 6 sccm during doping, and at this rate the interface oxide thickness also reaches its maximum value. Under this condition, the Cr/ITO interface also shows the best thermal stability. Wire bond testing shows that the wire pull strength is affected by the thickness of Al film. The results of this study show that the Al film should not be thicker than 1 μm. [ABSTRACT FROM AUTHOR]
ISSN:01694243
DOI:10.1163/156856103322584227