APA (7th ed.) Citation

Huang, D., Tu, W., Zhang, X., Tsai, L., Wu, T., & Lin, M. (2016). Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. Microelectronics Reliability, 65, 131. https://doi.org/10.1016/j.microrel.2016.07.006

Chicago Style (17th ed.) Citation

Huang, De-Shau, Wen-Bin Tu, Xiu-Ming Zhang, Liang-Te Tsai, Ti-Yuan Wu, and Ming-Tzer Lin. "Using Taguchi Method to Obtain the Optimal Design of Heat Dissipation Mechanism for Electronic Component Packaging." Microelectronics Reliability 65 (2016): 131. https://doi.org/10.1016/j.microrel.2016.07.006.

MLA (9th ed.) Citation

Huang, De-Shau, et al. "Using Taguchi Method to Obtain the Optimal Design of Heat Dissipation Mechanism for Electronic Component Packaging." Microelectronics Reliability, vol. 65, 2016, p. 131, https://doi.org/10.1016/j.microrel.2016.07.006.