Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging.
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| Title: | Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. |
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| Authors: | Huang, De-Shau1, Tu, Wen-Bin2, Zhang, Xiu-Ming2, Tsai, Liang-Te2, Wu, Ti-Yuan2, Lin, Ming-Tzer2 mingtlin@nchu.edu.tw |
| Source: | Microelectronics Reliability. Oct2016, Vol. 65, p131-141. 11p. |
| Subjects: | Electronics packaging, Taguchi methods, Optimal designs (Statistics), Heat transfer, Energy dissipation |
| Abstract: | Packaging technology developments in semiconductor chips are moving towards miniaturization, thinner products, lighter weights, and higher performance. However, in the process of packaging, warpage and residual stress have always been major problems, such as pin deviation, breakage, and weak signals. Further, the distinctive properties of the numerous materials that comprise a semiconductor chip demand different molding temperatures; thus, excessive internal thermal stresses are produced within the packaging structure which ultimately results in colloid warpage. This study used a 3D coordinate measuring machine to determine the levels of warpage produced in electronic packaging products and to verify the amount of warpage simulated by the finite element method. Then, Taguchi method was also utilized to analyze and discuss the four critical control factors namely: (1) shape of the heat sink; (2) thickness of molding; (3) molding temperature; and (4) thickness of soldering tin. Thus, the minimum thermal stress for electronic packaging components was obtained, which meant the optimal parameter combination for the packaging was a triangle-shaped heat sink, with a molding compound of 1.175 mm thick, a molding temperature of 170 °C, and a soldering tin that was 0.03 mm thick. [ABSTRACT FROM AUTHOR] |
| Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 118740062 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Huang%2C+De-Shau%22">Huang, De-Shau</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Tu%2C+Wen-Bin%22">Tu, Wen-Bin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Zhang%2C+Xiu-Ming%22">Zhang, Xiu-Ming</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Tsai%2C+Liang-Te%22">Tsai, Liang-Te</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Wu%2C+Ti-Yuan%22">Wu, Ti-Yuan</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Lin%2C+Ming-Tzer%22">Lin, Ming-Tzer</searchLink><relatesTo>2</relatesTo><i> mingtlin@nchu.edu.tw</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Oct2016, Vol. 65, p131-141. 11p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Electronics+packaging%22">Electronics packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Taguchi+methods%22">Taguchi methods</searchLink><br /><searchLink fieldCode="DE" term="%22Optimal+designs+%28Statistics%29%22">Optimal designs (Statistics)</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+transfer%22">Heat transfer</searchLink><br /><searchLink fieldCode="DE" term="%22Energy+dissipation%22">Energy dissipation</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Packaging technology developments in semiconductor chips are moving towards miniaturization, thinner products, lighter weights, and higher performance. However, in the process of packaging, warpage and residual stress have always been major problems, such as pin deviation, breakage, and weak signals. Further, the distinctive properties of the numerous materials that comprise a semiconductor chip demand different molding temperatures; thus, excessive internal thermal stresses are produced within the packaging structure which ultimately results in colloid warpage. This study used a 3D coordinate measuring machine to determine the levels of warpage produced in electronic packaging products and to verify the amount of warpage simulated by the finite element method. Then, Taguchi method was also utilized to analyze and discuss the four critical control factors namely: (1) shape of the heat sink; (2) thickness of molding; (3) molding temperature; and (4) thickness of soldering tin. Thus, the minimum thermal stress for electronic packaging components was obtained, which meant the optimal parameter combination for the packaging was a triangle-shaped heat sink, with a molding compound of 1.175 mm thick, a molding temperature of 170 °C, and a soldering tin that was 0.03 mm thick. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/j.microrel.2016.07.006 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 131 Subjects: – SubjectFull: Electronics packaging Type: general – SubjectFull: Taguchi methods Type: general – SubjectFull: Optimal designs (Statistics) Type: general – SubjectFull: Heat transfer Type: general – SubjectFull: Energy dissipation Type: general Titles: – TitleFull: Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Huang, De-Shau – PersonEntity: Name: NameFull: Tu, Wen-Bin – PersonEntity: Name: NameFull: Zhang, Xiu-Ming – PersonEntity: Name: NameFull: Tsai, Liang-Te – PersonEntity: Name: NameFull: Wu, Ti-Yuan – PersonEntity: Name: NameFull: Lin, Ming-Tzer IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 10 Text: Oct2016 Type: published Y: 2016 Identifiers: – Type: issn-print Value: 00262714 Numbering: – Type: volume Value: 65 Titles: – TitleFull: Microelectronics Reliability Type: main |
| ResultId | 1 |
