The effect of hardware needed for redundant interconnection lines and exchanging switches on the yield of VLSI chips with redundancy.

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Bibliographic Details
Title: The effect of hardware needed for redundant interconnection lines and exchanging switches on the yield of VLSI chips with redundancy.
Authors: Tomabechi, Nobuhiro1
Source: Systems & Computers in Japan. 7/1/1997, Vol. 28 Issue 8, p8-16. 9p.
Subjects: Very large scale circuit integration, Transputers, Very high speed integrated circuits, Integrated circuits, Electronic circuits, Computers
Abstract: This paper analyzes the effect of hardware needed for redundant interconnection lines and exchanging switches on the yield of VLSI with redundancy. As a defect distribution pattern, the Gamma distribution is assumed. Under this condition, the yields of areas on a VLSI correlate with each other. This paper presents the normalized chip expansibility as a figure of merit to evaluate the effect of introducing redundancy into VLSI. It is made clear that the normalized chip expansibility is effectively employed to represent the effect of the hardware redundant interconnection lines and exchanging switches on the yield of a VLSI. © 1997 Scripta Technica, Inc. Syst Comp Jpn, 28(8): 8–16, 1997 [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:This paper analyzes the effect of hardware needed for redundant interconnection lines and exchanging switches on the yield of VLSI with redundancy. As a defect distribution pattern, the Gamma distribution is assumed. Under this condition, the yields of areas on a VLSI correlate with each other. This paper presents the normalized chip expansibility as a figure of merit to evaluate the effect of introducing redundancy into VLSI. It is made clear that the normalized chip expansibility is effectively employed to represent the effect of the hardware redundant interconnection lines and exchanging switches on the yield of a VLSI. © 1997 Scripta Technica, Inc. Syst Comp Jpn, 28(8): 8–16, 1997 [ABSTRACT FROM AUTHOR]
ISSN:08821666
DOI:10.1002/(SICI)1520-684X(199708)28:8<8::AID-SCJ2>3.0.CO;2-I