Bibliographic Details
| Title: |
Design and Evaluation of Wafer Transfer System for LSI Production. |
| Authors: |
Sakano, Susumu1, Kuroda, Hisao1, Asakawa, Makoto1 |
| Source: |
Electronics & Communications in Japan, Part 2: Electronics. Aug87, Vol. 70 Issue 8, p30-42. 13p. |
| Subjects: |
Wafer-scale integration of circuits, Systolic array circuits, Very large scale circuit integration, Integrated circuits, Electronic circuits, Electronic systems |
| Abstract: |
An automatic wafer transportation system has been developed that is suitable for the LSI fabrication line. Design objectives have been to achieve a flexible wafer routing and flexible line construction ensuring a high degree of cleanliness. The system consists of a computer-controlled carriage system carrying wafer cassettes on a ceiling track, and standardized interface mechanisms installed on each equipment. This paper describes technical factors involved in the realization of flexible lines, and considers also fundamental track arrangement, carriage characteristics, a wafer-routing control method, and low dust mechanisms. [ABSTRACT FROM AUTHOR] |
|
Copyright of Electronics & Communications in Japan, Part 2: Electronics is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) |
| Database: |
Engineering Source |