Design and Evaluation of Wafer Transfer System for LSI Production.
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| Title: | Design and Evaluation of Wafer Transfer System for LSI Production. |
|---|---|
| Authors: | Sakano, Susumu1, Kuroda, Hisao1, Asakawa, Makoto1 |
| Source: | Electronics & Communications in Japan, Part 2: Electronics. Aug87, Vol. 70 Issue 8, p30-42. 13p. |
| Subjects: | Wafer-scale integration of circuits, Systolic array circuits, Very large scale circuit integration, Integrated circuits, Electronic circuits, Electronic systems |
| Abstract: | An automatic wafer transportation system has been developed that is suitable for the LSI fabrication line. Design objectives have been to achieve a flexible wafer routing and flexible line construction ensuring a high degree of cleanliness. The system consists of a computer-controlled carriage system carrying wafer cassettes on a ceiling track, and standardized interface mechanisms installed on each equipment. This paper describes technical factors involved in the realization of flexible lines, and considers also fundamental track arrangement, carriage characteristics, a wafer-routing control method, and low dust mechanisms. [ABSTRACT FROM AUTHOR] |
| Copyright of Electronics & Communications in Japan, Part 2: Electronics is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 13865175 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Design and Evaluation of Wafer Transfer System for LSI Production. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Sakano%2C+Susumu%22">Sakano, Susumu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kuroda%2C+Hisao%22">Kuroda, Hisao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Asakawa%2C+Makoto%22">Asakawa, Makoto</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Electronics+%26+Communications+in+Japan%2C+Part+2%3A+Electronics%22">Electronics & Communications in Japan, Part 2: Electronics</searchLink>. Aug87, Vol. 70 Issue 8, p30-42. 13p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Wafer-scale+integration+of+circuits%22">Wafer-scale integration of circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Systolic+array+circuits%22">Systolic array circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Very+large+scale+circuit+integration%22">Very large scale circuit integration</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+circuits%22">Electronic circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+systems%22">Electronic systems</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: An automatic wafer transportation system has been developed that is suitable for the LSI fabrication line. Design objectives have been to achieve a flexible wafer routing and flexible line construction ensuring a high degree of cleanliness. The system consists of a computer-controlled carriage system carrying wafer cassettes on a ceiling track, and standardized interface mechanisms installed on each equipment. This paper describes technical factors involved in the realization of flexible lines, and considers also fundamental track arrangement, carriage characteristics, a wafer-routing control method, and low dust mechanisms. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Electronics & Communications in Japan, Part 2: Electronics is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1002/ecjb.4420700804 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 13 StartPage: 30 Subjects: – SubjectFull: Wafer-scale integration of circuits Type: general – SubjectFull: Systolic array circuits Type: general – SubjectFull: Very large scale circuit integration Type: general – SubjectFull: Integrated circuits Type: general – SubjectFull: Electronic circuits Type: general – SubjectFull: Electronic systems Type: general Titles: – TitleFull: Design and Evaluation of Wafer Transfer System for LSI Production. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Sakano, Susumu – PersonEntity: Name: NameFull: Kuroda, Hisao – PersonEntity: Name: NameFull: Asakawa, Makoto IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Text: Aug87 Type: published Y: 1987 Identifiers: – Type: issn-print Value: 8756663X Numbering: – Type: volume Value: 70 – Type: issue Value: 8 Titles: – TitleFull: Electronics & Communications in Japan, Part 2: Electronics Type: main |
| ResultId | 1 |
