Downscaling of Floating-Gate EEPROM Modules for ASIC Applications.

Saved in:
Bibliographic Details
Title: Downscaling of Floating-Gate EEPROM Modules for ASIC Applications.
Authors: Shiba, Kazuyoshi1, Kubota, Katsuhiko1
Source: Electronics & Communications in Japan, Part 2: Electronics. Dec92, Vol. 75 Issue 12, p67-76. 10p.
Subjects: Integrated circuits, Read-only memory, Electronic circuits, Scaling laws (Statistical physics), Logic circuits, Computer circuits
Abstract: Downscaling methods of electrically erasable pros grammable ROM (EEPROM) for application-specific integrated circuit (ASIC) applications based on the double-poly floating-gate process were studied. Simple sealing of ASIC and EEPROM modules with the same scaling factor can significantly reduce the time for design and development. Horizontal scaling of the memory cell with unchanged vertical dimensions does not alter the cell performance because the capacitance coupling ratios are kept constant. Vertical scaling, which further reduces the cell size due to less short channel effects, requires the improvement in the tunnel oxide quality. For this purpose, an improved process also was studied in terms of process temperature and phosphorus concentration in polysilicon gate. [ABSTRACT FROM AUTHOR]
Copyright of Electronics & Communications in Japan, Part 2: Electronics is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
Description
Abstract:Downscaling methods of electrically erasable pros grammable ROM (EEPROM) for application-specific integrated circuit (ASIC) applications based on the double-poly floating-gate process were studied. Simple sealing of ASIC and EEPROM modules with the same scaling factor can significantly reduce the time for design and development. Horizontal scaling of the memory cell with unchanged vertical dimensions does not alter the cell performance because the capacitance coupling ratios are kept constant. Vertical scaling, which further reduces the cell size due to less short channel effects, requires the improvement in the tunnel oxide quality. For this purpose, an improved process also was studied in terms of process temperature and phosphorus concentration in polysilicon gate. [ABSTRACT FROM AUTHOR]
ISSN:8756663X
DOI:10.1002/ecjb.4420751208