Bibliographic Details
| Title: |
The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder. |
| Authors: |
Kurihara, Yasutoshi1, Hosokawa, Takashi1, Saitoh, Ryuichi1 |
| Source: |
Electronics & Communications in Japan, Part 2: Electronics. Jul95, Vol. 78 Issue 7, p82-90. 9p. |
| Subjects: |
Semiconductor diffusion, Electrodiffusion, Semiconductors, Heat treatment of metals, Annealing of metals, Solder & soldering |
| Abstract: |
The influence of heat treatment of Al-Cr-Ni-Ag multilayer metallization on the nonuniform wetting of an Sn-Sb solder was investigated. The goal was to obtain highly reliable semiconductor power devices by improving solder adhesion. Increase in thermal resistance after thermal fatigue testing is attributed to the nonuniform wetting of the solder to the semiconductor chips, which caused thermal stress to concentrate on the wetted regions and promoted the selective cracking of these regions. The heat treatment of the multilayer metallization at 500°C caused Al (the bottom layer) diffusion to the surface of the Ag layer. Al exposed to the surface prevented uniform wetting of the solder and caused poor wetting. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |
