APA (7th ed.) Citation

Kurihara, Y., Hosokawa, T., & Saitoh, R. (1995). The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder. Electronics & Communications in Japan, Part 2: Electronics, 78(7), 82. https://doi.org/10.1002/ecjb.4420780709

Chicago Style (17th ed.) Citation

Kurihara, Yasutoshi, Takashi Hosokawa, and Ryuichi Saitoh. "The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder." Electronics & Communications in Japan, Part 2: Electronics 78, no. 7 (1995): 82. https://doi.org/10.1002/ecjb.4420780709.

MLA (9th ed.) Citation

Kurihara, Yasutoshi, et al. "The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder." Electronics & Communications in Japan, Part 2: Electronics, vol. 78, no. 7, 1995, p. 82, https://doi.org/10.1002/ecjb.4420780709.