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The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder.

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Title: The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder.
Authors: Kurihara, Yasutoshi1, Hosokawa, Takashi1, Saitoh, Ryuichi1
Source: Electronics & Communications in Japan, Part 2: Electronics. Jul95, Vol. 78 Issue 7, p82-90. 9p.
Subjects: Semiconductor diffusion, Electrodiffusion, Semiconductors, Heat treatment of metals, Annealing of metals, Solder & soldering
Abstract: The influence of heat treatment of Al-Cr-Ni-Ag multilayer metallization on the nonuniform wetting of an Sn-Sb solder was investigated. The goal was to obtain highly reliable semiconductor power devices by improving solder adhesion. Increase in thermal resistance after thermal fatigue testing is attributed to the nonuniform wetting of the solder to the semiconductor chips, which caused thermal stress to concentrate on the wetted regions and promoted the selective cracking of these regions. The heat treatment of the multilayer metallization at 500°C caused Al (the bottom layer) diffusion to the surface of the Ag layer. Al exposed to the surface prevented uniform wetting of the solder and caused poor wetting. [ABSTRACT FROM AUTHOR]
Copyright of Electronics & Communications in Japan, Part 2: Electronics is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 14079342
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder.
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  Data: <searchLink fieldCode="AR" term="%22Kurihara%2C+Yasutoshi%22">Kurihara, Yasutoshi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Hosokawa%2C+Takashi%22">Hosokawa, Takashi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Saitoh%2C+Ryuichi%22">Saitoh, Ryuichi</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Electronics+%26+Communications+in+Japan%2C+Part+2%3A+Electronics%22">Electronics & Communications in Japan, Part 2: Electronics</searchLink>. Jul95, Vol. 78 Issue 7, p82-90. 9p.
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  Data: <searchLink fieldCode="DE" term="%22Semiconductor+diffusion%22">Semiconductor diffusion</searchLink><br /><searchLink fieldCode="DE" term="%22Electrodiffusion%22">Electrodiffusion</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductors%22">Semiconductors</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+treatment+of+metals%22">Heat treatment of metals</searchLink><br /><searchLink fieldCode="DE" term="%22Annealing+of+metals%22">Annealing of metals</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The influence of heat treatment of Al-Cr-Ni-Ag multilayer metallization on the nonuniform wetting of an Sn-Sb solder was investigated. The goal was to obtain highly reliable semiconductor power devices by improving solder adhesion. Increase in thermal resistance after thermal fatigue testing is attributed to the nonuniform wetting of the solder to the semiconductor chips, which caused thermal stress to concentrate on the wetted regions and promoted the selective cracking of these regions. The heat treatment of the multilayer metallization at 500°C caused Al (the bottom layer) diffusion to the surface of the Ag layer. Al exposed to the surface prevented uniform wetting of the solder and caused poor wetting. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
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  Group: Ab
  Data: <i>Copyright of Electronics & Communications in Japan, Part 2: Electronics is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1002/ecjb.4420780709
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 82
    Subjects:
      – SubjectFull: Semiconductor diffusion
        Type: general
      – SubjectFull: Electrodiffusion
        Type: general
      – SubjectFull: Semiconductors
        Type: general
      – SubjectFull: Heat treatment of metals
        Type: general
      – SubjectFull: Annealing of metals
        Type: general
      – SubjectFull: Solder & soldering
        Type: general
    Titles:
      – TitleFull: The Influence of Interdiffusion of Metals in an Evaporated Multilayer Metallization on the Adhesion of an Sn-Sb Solder.
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            NameFull: Kurihara, Yasutoshi
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            NameFull: Hosokawa, Takashi
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            NameFull: Saitoh, Ryuichi
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          Dates:
            – D: 01
              M: 07
              Text: Jul95
              Type: published
              Y: 1995
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              Value: 8756663X
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              Value: 78
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              Value: 7
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            – TitleFull: Electronics & Communications in Japan, Part 2: Electronics
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