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INNOVATIVE PUCK DESIGN FOR THE MECHANICAL CROSS-SECTIONING AND SUBSEQUENT ANALYSIS OF SEMICONDUCTOR PACKAGED SAMPLES IN FAILURE ANALYSIS.

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Bibliographic Details
Title: INNOVATIVE PUCK DESIGN FOR THE MECHANICAL CROSS-SECTIONING AND SUBSEQUENT ANALYSIS OF SEMICONDUCTOR PACKAGED SAMPLES IN FAILURE ANALYSIS.
Authors: Khatkhatay, Fauzia1, Pichumani, Pradip Sairam1 pradipsairam.pichumani@globalfoundries.com
Source: Electronic Device Failure Analysis. May2020, Vol. 22 Issue 2, p4-12. 8p.
Subjects: Failure analysis, Semiconductor analysis, Flip chip technology, Materials science
Abstract: The article focuses on innovative puck design for the mechanical cross-sectioning of semiconductor flip-chip packaged devices in the failure analysis. Topics discussed include chemical mechanical polishing (CMP) in wafer fabrication to reduce the polishing time, the use of the polishing process in the CMP of silicon wafers in integrated circuit (IC) fabrication and investigation of the material-removal rate (MRR).
Database: Engineering Source
Description
Abstract:The article focuses on innovative puck design for the mechanical cross-sectioning of semiconductor flip-chip packaged devices in the failure analysis. Topics discussed include chemical mechanical polishing (CMP) in wafer fabrication to reduce the polishing time, the use of the polishing process in the CMP of silicon wafers in integrated circuit (IC) fabrication and investigation of the material-removal rate (MRR).
ISSN:15370755
DOI:10.31399/asm.edfa.2020-2.p004