APA (7th ed.) Citation

Khatkhatay, F., & Pichumani, P. S. (2020). INNOVATIVE PUCK DESIGN FOR THE MECHANICAL CROSS-SECTIONING AND SUBSEQUENT ANALYSIS OF SEMICONDUCTOR PACKAGED SAMPLES IN FAILURE ANALYSIS. Electronic Device Failure Analysis, 22(2), 4. https://doi.org/10.31399/asm.edfa.2020-2.p004

Chicago Style (17th ed.) Citation

Khatkhatay, Fauzia, and Pradip Sairam Pichumani. "INNOVATIVE PUCK DESIGN FOR THE MECHANICAL CROSS-SECTIONING AND SUBSEQUENT ANALYSIS OF SEMICONDUCTOR PACKAGED SAMPLES IN FAILURE ANALYSIS." Electronic Device Failure Analysis 22, no. 2 (2020): 4. https://doi.org/10.31399/asm.edfa.2020-2.p004.

MLA (9th ed.) Citation

Khatkhatay, Fauzia, and Pradip Sairam Pichumani. "INNOVATIVE PUCK DESIGN FOR THE MECHANICAL CROSS-SECTIONING AND SUBSEQUENT ANALYSIS OF SEMICONDUCTOR PACKAGED SAMPLES IN FAILURE ANALYSIS." Electronic Device Failure Analysis, vol. 22, no. 2, 2020, p. 4, https://doi.org/10.31399/asm.edfa.2020-2.p004.