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ESREF 2019 IN TOULOUSE.

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Title: ESREF 2019 IN TOULOUSE.
Authors: Nolhier, Nicolas1 nicolas.nolhier@laas.fr, Bascoul, Guillaume1 guillaume.bascoul@cnes.fr
Source: Electronic Device Failure Analysis. May2020, Vol. 22 Issue 2, p26-30. 5p.
Subjects: Failure Analysis System (Computer system), Failure analysis, Materials management
Geographic Terms: Toulouse (France)
Abstract: The article offers information on the 30th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019) that was held in Toulouse, France from September 23-26, 2019. Topics discussed include the Technical Program Committee (TPC), space and aeronautic systems; and layered dielectrics in solid-state microelectronic devices by Mario Lanza.
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 143103508
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: ESREF 2019 IN TOULOUSE.
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  Data: <searchLink fieldCode="JN" term="%22Electronic+Device+Failure+Analysis%22">Electronic Device Failure Analysis</searchLink>. May2020, Vol. 22 Issue 2, p26-30. 5p.
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  Data: The article offers information on the 30th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019) that was held in Toulouse, France from September 23-26, 2019. Topics discussed include the Technical Program Committee (TPC), space and aeronautic systems; and layered dielectrics in solid-state microelectronic devices by Mario Lanza.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=143103508
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      – Code: eng
        Text: English
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        PageCount: 5
        StartPage: 26
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      – SubjectFull: Failure Analysis System (Computer system)
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      – SubjectFull: Failure analysis
        Type: general
      – SubjectFull: Materials management
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      – SubjectFull: Toulouse (France)
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              Text: May2020
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              Y: 2020
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