Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil.
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| Title: | Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil. |
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| Authors: | Yu, Linping1 (AUTHOR) linping_yu@csust.edu.cn, Chen, Long1 (AUTHOR), Chen, Qizhi2 (AUTHOR), Feng, Luli3 (AUTHOR), Xu, Ziyi1 (AUTHOR), Nan, Bo4 (AUTHOR), Kang, Xiyue1,3 (AUTHOR) xiyuekang@csu.edu.cn, He, Yuehui3 (AUTHOR) |
| Source: | Journal of Industrial & Engineering Chemistry. Nov2021, Vol. 103, p118-123. 6p. |
| Subjects: | Alloys, Alloy plating, Copper corrosion, Porosity, Corrosion resistance, Electrolytic corrosion, Temperature control, Tensile strength |
| Abstract: | [Display omitted] • An ultrathin Ni-Cu alloy foil was prepared by electrodeposition-vacuum sintering method. • The uniform composition can be achieved through mutual diffusion of atoms. • The Kirkendall pores can be avoided by controlling the sintering temperature. • The Ni-Cu alloy foil shows superior corrosion resistance compared with Cu foil. Cost-effective ultrathin alloy foils (<20 μm) are highly expected with the development of electronic industry and micro-system technology. In this paper, electrodeposition combined with vacuum sintering is used to fabricate a Ni-Cu alloy foil with thickness of 12.0 (±0.2) μm. For the ultrathin Ni-Cu alloy foil, a densified structure without pores can be achieved by prolonging sintering duration at 900 ℃ for 3 h. Under the current density of 10 mA cm−2, 700 s is the optimal electrodeposition time to obtain the highest tensile strength (187 MPa) with the Ni content of 41.5 wt.% in the alloy foil. Compared with Cu foil, Ni-Cu alloy foil shows superior corrosion resistance in 3.5 wt.% NaCl solution and also HCl solutions (0.5 mol/L, 1.0 mol/L, 2.0 mol/L), respectively. The uniform composition and defect-free surface, excellent tensile strength and corrosion resistance together exhibits the great application potential of the obtained Ni-Cu alloy foil, which may provide an inspiration for future development of integrated electronic or medical devices. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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