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Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.

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Bibliographic Details
Title: Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
Authors: Sharma, Ved Prakash1,2 (AUTHOR), Datla, Naresh Varma1 (AUTHOR) datla@mech.iitd.ac.in
Source: Microelectronics Reliability. Dec2021, Vol. 127, pN.PAG-N.PAG. 1p.
Subjects: Solder joints, Lead-free solder, Copper-tin alloys, Scanning electron microscopy, Intermetallic compounds
Abstract: The effects of aging time and loading rate on the mode-I fracture behavior of the lead-free Cu/Sn-0.7Cu solder joint was studied using double cantilever beam (DCB) specimens. The variations in critical energy release rate for crack-initiation (G ci) of the joint, intermetallic compound (IMC) layer thickness, energy dispersive spectroscopy (EDS), and scanning electron microscopy based fractography were used to explain the fracture behavior. The fracture tests of DCB specimens aged at 200 °C for 6 to 96 h showed that increasing the aging time significantly decreased the G ci of the joint. This decrease in G ci with aging was attributed mainly to an increase in IMC layer thickness with aging time as well as change in failure behavior from ductile within the solder to brittle about the IMC layer. As the cross-head speed is increased from 0.1 to 500 mm/min, the G ci of the joint initially increased and then significantly decreased. The decrease in G ci with increasing loading rate is due to change in failure behavior from ductile within solder to brittle about solder-IMC interface. • Shown aging time and loading rate effects on Cu/Sn-0.7Cu solder joint fracture • Double cantilever beam tests show decrease in fracture toughness with aging. • Initiation toughness initially increased with loading rate and then decreased. • Crack path reaches IMC layer at relatively high aging times and loading rates. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:The effects of aging time and loading rate on the mode-I fracture behavior of the lead-free Cu/Sn-0.7Cu solder joint was studied using double cantilever beam (DCB) specimens. The variations in critical energy release rate for crack-initiation (G ci) of the joint, intermetallic compound (IMC) layer thickness, energy dispersive spectroscopy (EDS), and scanning electron microscopy based fractography were used to explain the fracture behavior. The fracture tests of DCB specimens aged at 200 °C for 6 to 96 h showed that increasing the aging time significantly decreased the G ci of the joint. This decrease in G ci with aging was attributed mainly to an increase in IMC layer thickness with aging time as well as change in failure behavior from ductile within the solder to brittle about the IMC layer. As the cross-head speed is increased from 0.1 to 500 mm/min, the G ci of the joint initially increased and then significantly decreased. The decrease in G ci with increasing loading rate is due to change in failure behavior from ductile within solder to brittle about solder-IMC interface. • Shown aging time and loading rate effects on Cu/Sn-0.7Cu solder joint fracture • Double cantilever beam tests show decrease in fracture toughness with aging. • Initiation toughness initially increased with loading rate and then decreased. • Crack path reaches IMC layer at relatively high aging times and loading rates. [ABSTRACT FROM AUTHOR]
ISSN:00262714
DOI:10.1016/j.microrel.2021.114381