APA (7th ed.) Citation

Sharma, V. P., & Datla, N. V. (2021). Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints. Microelectronics Reliability, 127, N.PAG. https://doi.org/10.1016/j.microrel.2021.114381

Chicago Style (17th ed.) Citation

Sharma, Ved Prakash, and Naresh Varma Datla. "Effect of Aging Time and Loading Rate on Fracture Behavior of Cu/Sn-0.7Cu Solder Joints." Microelectronics Reliability 127 (2021): N.PAG. https://doi.org/10.1016/j.microrel.2021.114381.

MLA (9th ed.) Citation

Sharma, Ved Prakash, and Naresh Varma Datla. "Effect of Aging Time and Loading Rate on Fracture Behavior of Cu/Sn-0.7Cu Solder Joints." Microelectronics Reliability, vol. 127, 2021, p. N.PAG, https://doi.org/10.1016/j.microrel.2021.114381.