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Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.

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Title: Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
Authors: Sharma, Ved Prakash1,2 (AUTHOR), Datla, Naresh Varma1 (AUTHOR) datla@mech.iitd.ac.in
Source: Microelectronics Reliability. Dec2021, Vol. 127, pN.PAG-N.PAG. 1p.
Subjects: Solder joints, Lead-free solder, Copper-tin alloys, Scanning electron microscopy, Intermetallic compounds
Abstract: The effects of aging time and loading rate on the mode-I fracture behavior of the lead-free Cu/Sn-0.7Cu solder joint was studied using double cantilever beam (DCB) specimens. The variations in critical energy release rate for crack-initiation (G ci) of the joint, intermetallic compound (IMC) layer thickness, energy dispersive spectroscopy (EDS), and scanning electron microscopy based fractography were used to explain the fracture behavior. The fracture tests of DCB specimens aged at 200 °C for 6 to 96 h showed that increasing the aging time significantly decreased the G ci of the joint. This decrease in G ci with aging was attributed mainly to an increase in IMC layer thickness with aging time as well as change in failure behavior from ductile within the solder to brittle about the IMC layer. As the cross-head speed is increased from 0.1 to 500 mm/min, the G ci of the joint initially increased and then significantly decreased. The decrease in G ci with increasing loading rate is due to change in failure behavior from ductile within solder to brittle about solder-IMC interface. • Shown aging time and loading rate effects on Cu/Sn-0.7Cu solder joint fracture • Double cantilever beam tests show decrease in fracture toughness with aging. • Initiation toughness initially increased with loading rate and then decreased. • Crack path reaches IMC layer at relatively high aging times and loading rates. [ABSTRACT FROM AUTHOR]
Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
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Header DbId: egs
DbLabel: Engineering Source
An: 153681007
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
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  Label: Title
  Group: Ti
  Data: Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
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  Data: <searchLink fieldCode="AR" term="%22Sharma%2C+Ved+Prakash%22">Sharma, Ved Prakash</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Datla%2C+Naresh+Varma%22">Datla, Naresh Varma</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> datla@mech.iitd.ac.in</i>
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  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Dec2021, Vol. 127, pN.PAG-N.PAG. 1p.
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  Data: <searchLink fieldCode="DE" term="%22Solder+joints%22">Solder joints</searchLink><br /><searchLink fieldCode="DE" term="%22Lead-free+solder%22">Lead-free solder</searchLink><br /><searchLink fieldCode="DE" term="%22Copper-tin+alloys%22">Copper-tin alloys</searchLink><br /><searchLink fieldCode="DE" term="%22Scanning+electron+microscopy%22">Scanning electron microscopy</searchLink><br /><searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The effects of aging time and loading rate on the mode-I fracture behavior of the lead-free Cu/Sn-0.7Cu solder joint was studied using double cantilever beam (DCB) specimens. The variations in critical energy release rate for crack-initiation (G ci) of the joint, intermetallic compound (IMC) layer thickness, energy dispersive spectroscopy (EDS), and scanning electron microscopy based fractography were used to explain the fracture behavior. The fracture tests of DCB specimens aged at 200 °C for 6 to 96 h showed that increasing the aging time significantly decreased the G ci of the joint. This decrease in G ci with aging was attributed mainly to an increase in IMC layer thickness with aging time as well as change in failure behavior from ductile within the solder to brittle about the IMC layer. As the cross-head speed is increased from 0.1 to 500 mm/min, the G ci of the joint initially increased and then significantly decreased. The decrease in G ci with increasing loading rate is due to change in failure behavior from ductile within solder to brittle about solder-IMC interface. • Shown aging time and loading rate effects on Cu/Sn-0.7Cu solder joint fracture • Double cantilever beam tests show decrease in fracture toughness with aging. • Initiation toughness initially increased with loading rate and then decreased. • Crack path reaches IMC layer at relatively high aging times and loading rates. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.microrel.2021.114381
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      – Code: eng
        Text: English
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        PageCount: 1
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      – SubjectFull: Solder joints
        Type: general
      – SubjectFull: Lead-free solder
        Type: general
      – SubjectFull: Copper-tin alloys
        Type: general
      – SubjectFull: Scanning electron microscopy
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      – SubjectFull: Intermetallic compounds
        Type: general
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      – TitleFull: Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
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            NameFull: Sharma, Ved Prakash
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            NameFull: Datla, Naresh Varma
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            – D: 01
              M: 12
              Text: Dec2021
              Type: published
              Y: 2021
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              Value: 127
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