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Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints.

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Title: Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints.
Authors: Sharma, Ved Prakash1,2 (AUTHOR), Datla, Naresh V.1 (AUTHOR) datla@mech.iitd.ac.in
Source: Engineering Failure Analysis. Jan2022, Vol. 131, pN.PAG-N.PAG. 1p.
Subjects: Separation (Law), Solder joints, Lead-free solder, Threshold energy
Abstract: • Failure of lead-free solder joints studied using both fracture tests and FE model. • Bond-line thickness and mode-mixity effects on traction separation law (TSL) studied. • Initiation toughness and maximum traction increased only with thickness. • Failure behavior correlated with plastic zone and normal stresses ahead of crack. In this research, cohesive parameters were extracted for Sn-0.7Cu/Cu solder joint failure. Double cantilever beam (DCB) specimens were used to study the fracture of the joint under both mode-I and mixed-mode conditions. A bilinear traction separation law (TSL) was used to capture the failure of the joint. Increasing the bond-line thickness from 110 to 880 µm increased the critical energy release rate for crack initiation (G ci) and maximum traction of the bilinear TSL. This increase in the G ci was attributed to an increase in plastic zone area (PZA) ahead of the pre-crack tip. Varying the mode-mixity with phase angle (ψ) in the range of 00–330 showed an insignificant change in G ci and maximum traction of the bilinear TSL. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:• Failure of lead-free solder joints studied using both fracture tests and FE model. • Bond-line thickness and mode-mixity effects on traction separation law (TSL) studied. • Initiation toughness and maximum traction increased only with thickness. • Failure behavior correlated with plastic zone and normal stresses ahead of crack. In this research, cohesive parameters were extracted for Sn-0.7Cu/Cu solder joint failure. Double cantilever beam (DCB) specimens were used to study the fracture of the joint under both mode-I and mixed-mode conditions. A bilinear traction separation law (TSL) was used to capture the failure of the joint. Increasing the bond-line thickness from 110 to 880 µm increased the critical energy release rate for crack initiation (G ci) and maximum traction of the bilinear TSL. This increase in the G ci was attributed to an increase in plastic zone area (PZA) ahead of the pre-crack tip. Varying the mode-mixity with phase angle (ψ) in the range of 00–330 showed an insignificant change in G ci and maximum traction of the bilinear TSL. [ABSTRACT FROM AUTHOR]
ISSN:13506307
DOI:10.1016/j.engfailanal.2021.105855